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Title: Application of X- ray diffraction to study the grinding induced surface damage mechanism of WC/Co
Authors: Zhang, Q 
Zhao, Q
To, S 
Guo, B
Keywords: Compressive stress
Preferred orientation
X-ray diffraction
Issue Date: 2017
Publisher: Elsevier
Source: International journal of refractory metals & hard materials, 2017, v. 64, p. 205-209 How to cite?
Journal: International journal of refractory metals & hard materials 
Abstract: X-ray diffraction was utilized to examine the WC/Co surface after high spindle speed grinding (HSSG) to get a further insight into the machining induced surface damage mechanism. The results showed that grinding induced reorientation and preferred {100}/{10 −10} growth of WC particles occurred in the deformed surface, while the crystallinity of WC(001) increased. Based on the analysis of the penetration depth of X ray in WC and Co, grazing incidence X-ray diffraction (GIXRD) showed that the grinding induced preferred crystal growth occurred only in the outmost layer (~ 3.324 nm), but the compressive stress was caused to a certain depth of the subsurface (> 756.18 nm).
ISSN: 0263-4368
DOI: 10.1016/j.ijrmhm.2016.11.006
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