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Title: Work-in-progress : communication optimization for thermal reliable many-core systems
Authors: Liu, W
Yang, L
Jiang, W
Guan, N 
Issue Date: 2017
Source: Proceedings of the 12th IEEE/ACM/IFIP International Conference on Hardware/Software Codesign and System Synthesis Companion, CODES 2017, 2017, a11
Abstract: System-level thermal management techniques normally map applications on non-adjacent cores to guarantee the safe temperature in many-core systems, while the communication efficiency will be oppositely affected by long-distance data transmission over conventional Network-on-Chips (NoC). SMART NoC has enabled single-cycle multi-hop bypass channels between distant cores, which can significantly reduce inter-processor communication latency. However, communication efficiency of SMART will be significantly diminished by express bypass break due to communication conflict. In order to achieve communication optimization with guaranteed system thermal reliability, we propose a dynamic reconfiguration method for logical interconnection topology through task mapping on top of SMART NoC. Active cores are physically decentralized on chip for better heat dissipation, while communication overhead can be reduced by minimized communication conflict and maximized bypass routing. Applicability and effectiveness of the proposed technique can be improved with significant achievements in reducing communication overhead and improving application performance, compared with state-of-the-art techniques.
Publisher: Association for Computing Machinery, Inc
ISBN: 9781450351850
DOI: 10.1145/3125502.3125539
Description: 12th IEEE/ACM/IFIP International Conference on Hardware/Software Codesign and System Synthesis, CODES 2017, Seoul, South Korea, 15-20 October, 2017
Appears in Collections:Conference Paper

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