Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/74834
Title: Surface damage mechanism of monocrystalline silicon during single point diamond grinding
Authors: Zhang, Q 
Fu, Y
Su, H
Zhao, Q
To, S 
Keywords: Monocrystalline Si
Phase transformation
Single point diamond grinding
Tribochemistry
Issue Date: 2018
Publisher: Elsevier Ltd
Source: Wear, 2018, v. 396-397, p. 48-55 How to cite?
Journal: Wear 
Abstract: Surface damage mechanism of single crystalline Si (100) under single point diamond grinding was investigated in the present study. The result, for the first time, showed that the ductile and brittle material removal appeared at different grinding positions of the diamond wheel due to the varied kinematics of the diamond grits in the cylindrical face and end face. Under the dynamic pressure of the diamond grits, amorphization and the transformation to high pressure phases (Si-III and Si-XI) of Si occurred, which were identified by both XRD and Raman spectroscopy. In addition, surface oxidation and chemical reaction between the Si, O, C and N atoms was analyzed by the XPS, and the new products of Si3N4 and graphite oxide (GO) are firstly proposed to be the surface damage of Si and the tool wear mechanism during the ultra-precision machining process.
URI: http://hdl.handle.net/10397/74834
ISSN: 0043-1648
DOI: 10.1016/j.wear.2017.11.008
Appears in Collections:Journal/Magazine Article

Access
View full-text via PolyU eLinks SFX Query
Show full item record

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.