Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/70141
Title: Superplastic deformation behavior of electrodeposited nickel matrix nanocomposite
Authors: Chan, KC 
Wang, CL
Wang, GF
Zhang, KF
Keywords: Electro-Deposition
Grain Growth
Nanocomposite
Superplasticity
Issue Date: 2007
Publisher: Trans Tech Publications Ltd
Source: Materials science forum, 2007, v. 551-552, p. 521-526 How to cite?
Journal: Materials science forum 
Abstract: In this paper, the superplastic deformation behaviour of a pulse electrodeposited Ni-SiC nanocomposite was further studied at temperatures ranging from 330 to 530oC. It was found that optimum temperature of the composite was 450oC, and the shape of its flow stress vs strain rate curves is similar to that of conventional superplastic materials. The microstructures of the composite before and after deformation were examined using SEM and TEM. Dislocations and deformation twinning were observed in the deformed samples, and there was significant grain growth during deformation. The deformation mechanisms were also discussed in the paper based on the experimental findings.
Description: 9th International Conference on Superplasticity in Advanced Materials - ICSAM 2006, 23-26 June 2006, Chengdu, P.R. China
URI: http://hdl.handle.net/10397/70141
ISBN: 978-3-908453-62-8 (CD)
978-0-87849-435-4 (CD+print)
978-3-03813-112-0 (ebook)
978-0-87849-435-4 (ebook+print)
ISSN: 0255-5476
EISSN: 1662-9752
DOI: 10.4028/www.scientific.net/MSF.551-552.521
Appears in Collections:Conference Paper

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