Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/68780
PIRA download icon_1.1View/Download Full Text
DC FieldValueLanguage
dc.contributorDepartment of Electronic and Information Engineering-
dc.creatorFok, KY-
dc.creatorCheng, CT-
dc.creatorTse, CK-
dc.date.accessioned2017-10-04T03:39:29Z-
dc.date.available2017-10-04T03:39:29Z-
dc.identifier.isbn978-1-4673-6853-7 (electronic)en_US
dc.identifier.isbn978-1-5090-1427-9 (Print on Demand(PoD))en_US
dc.identifier.urihttp://hdl.handle.net/10397/68780-
dc.language.isoenen_US
dc.publisherInstitute of Electrical and Electronics Engineersen_US
dc.rights© 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en_US
dc.rightsThe following publication K. Y. Fok, C. T. Cheng and C. K. Tse, "A refinement process for nozzle path planning in 3D printing," 2017 IEEE International Symposium on Circuits and Systems (ISCAS), Baltimore, MD, USA, 2017, pp. 1-4 is available at http://dx.doi.org/10.1109/ISCAS.2017.8050471en_US
dc.subjectAdditive manufacturingen_US
dc.subject3D printingen_US
dc.subjectURPPen_US
dc.subjectOptimizationen_US
dc.titleA refinement process for nozzle path planning in 3D printingen_US
dc.typeConference Paperen_US
dc.identifier.spage1en_US
dc.identifier.epage4en_US
dc.identifier.doi10.1109/ISCAS.2017.8050471-
dcterms.abstractA refinement process for nozzle path planning in 3D printing is presented in this paper. The nozzle path planning problem is formulated as an undirected rural postman problem (URPP). Based on the unique characteristics of URPP in 3D printing applications, a new refinement process is proposed to shorten the processing time of a conventional URPP solver. Performances of the proposed refinement process is evaluated using computer simulations. Simulation results show that when comparing with other URPP solvers, solvers with the proposed process have shorter processing time and can provide solutions with shorter transition length.-
dcterms.accessRightsopen accessen_US
dcterms.bibliographicCitation2017 IEEE International Symposium on Circuits and Systems (ISCAS’2017), Baltimore, MD, USA, 28-31 May 2017, p. 1-4-
dcterms.issued2017-
dc.identifier.ros2016005623-
dc.relation.conferenceIEEE International Symposium on Circuits and Systems [ISCAS]en_US
dc.identifier.rosgroupid2016005372-
dc.description.ros2016-2017 > Academic research: refereed > Refereed conference paper-
dc.description.validate201803_a bcwh-
dc.description.oaAccepted Manuscripten_US
dc.identifier.FolderNumbera0124-n03en_US
dc.description.pubStatusPublisheden_US
Appears in Collections:Conference Paper
Files in This Item:
File Description SizeFormat 
PID4688487.pdfPre-Published version609.91 kBAdobe PDFView/Open
Open Access Information
Status open access
File Version Final Accepted Manuscript
Access
View full-text via PolyU eLinks SFX Query
Show simple item record

Page views

260
Last Week
0
Last month
Citations as of Mar 24, 2024

Downloads

394
Citations as of Mar 24, 2024

SCOPUSTM   
Citations

7
Last Week
0
Last month
Citations as of Mar 29, 2024

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.