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Title: Polymer-bonded magnetic materials
Other Titles: 聚合物粘合的磁性材料
Authors: Cheng, KWE 
Wu, WT 
Cheung, TK 
Ding, K 
Cheong, CK 
Ho, YL 
Wong, YW 
Issue Date: 13-Aug-2014
Publisher: 中华人民共和国国家知识产权局
Source: 中国专利 ZL 200810099551.2 How to cite?
Abstract: The present invention relates to polymer-bonded magnetic materials for power conversion, particularly to a magnetic composition which includes a thermoplastic polymer and magnetic powders. The composition has a tensile strength of greater than 20 N/nm2.
Rights: 专利权人: The Hong Kong Polytechnic University.
Appears in Collections:Patent

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