Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/68732
| Title: | Polymer-bonded magnetic materials | Other Title: | 聚合物粘合的磁性材料 | Authors: | Cheng, KWE Wu, WT Cheung, TK Ding, K Cheong, CK Ho, YL Wong, YW |
Issue Date: | 13-Aug-2014 | Source: | 中国专利 ZL 200810099551.2 | Abstract: | The present invention relates to polymer-bonded magnetic materials for power conversion, particularly to a magnetic composition which includes a thermoplastic polymer and magnetic powders. The composition has a tensile strength of greater than 20 N/nm2. | Publisher: | 中华人民共和国国家知识产权局 | Rights: | 专利权人: The Hong Kong Polytechnic University. |
| Appears in Collections: | Patent |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| ZL200810099551.2.pdf | 1.09 MB | Adobe PDF | View/Open |
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