Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/68469
DC Field | Value | Language |
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dc.contributor | Department of Computing | - |
dc.creator | Pathak, AK | - |
dc.creator | Kwong, C | - |
dc.date.accessioned | 2017-08-22T05:55:08Z | - |
dc.date.available | 2017-08-22T05:55:08Z | - |
dc.identifier.uri | http://hdl.handle.net/10397/68469 | - |
dc.language.iso | en | en_US |
dc.rights | Assignee: The Hong Kong Polytechnic Univeristy. | en_US |
dc.title | Contactless 3D biometric feature identification system and method thereof | en_US |
dc.type | Patent | en_US |
dc.description.otherinformation | US8953854; US8953854 B2; US8953854B2; US8,953,854; US 8,953,854 B2; 8953854; Appl. No. 13/935,584 | en_US |
dcterms.abstract | The present invention discloses a contactless 3D biometric feature identification system and the method thereof. The system comprises of a fixed-viewpoint image capturing means, a lighting module capable of producing different illuminations on the object of interest and a microprocessor configured to execute a biometric identification algorithm. The algorithm starts with capturing a plurality of images with different illuminations. The captured images are then utilized to reconstruct a three dimensional surface model. Different features, for instance 2D and 3D coordinates and orientations of the biometric feature, surface curvature of the object and the local surface orientation of the object, are extracted from the captured images and the reconstructed 3D surface model. Different matching scores are also developed based on the aforesaid features to establish the identity of the biometric features. | - |
dcterms.bibliographicCitation | US Patent 8,953,854 B2. Washington, DC: US Patent and Trademark Office, 2015. | - |
dcterms.issued | 2015-02-10 | - |
dc.description.country | US | - |
dc.identifier.rosgroupid | 2014001957 | - |
dc.description.ros | 2014-2015 > Other Outputs > Patents granted | - |
dc.description.oa | Version of Record | en_US |
Appears in Collections: | Patent |
Files in This Item:
File | Description | Size | Format | |
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us8953854b2.pdf | 1.34 MB | Adobe PDF | View/Open |
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