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Title: Direct optical patterning of poly(dimethylsiloxane) microstructures for microfluidic chips
Authors: Gao, S
Tung, WT
Wong, DS
Bian, L
Zhang, AP
Keywords: Direct patterning
Optical maskless lithography
Photosensitive poly(dimethylsiloxane)
Issue Date: 2016
Publisher: SPIE-International Society for Optical Engineering
Source: Proceedings of SPIE : the International Society for Optical Engineering, 2016, v. 9685, 96850X How to cite?
Journal: Proceedings of SPIE : the International Society for Optical Engineering 
Abstract: In this paper, we present an optical maskless exposure approach for direct patterning of large-area high resolution microfluidic chips using photosensitive poly(dimethylsiloxane) (PDMS) materials. Both positive- and negative-tone photosensitive PDMS (photoPDMS) were successfully patterned into various microfluidic devices with complex geometries by using an optical maskless lithography process. The positive-tone PDMS is used for patterning of largearea chips, while the negative-tone PDMS is demonstrated to fabricate high-resolution microstructures and on-chip devices. With the seamless pattern-stitching technique, a large-area microfluidic chip with size of 5.5 × 2.8 cm2 with complex three-dimensional (3D) staggered herringbone mixers (SHMs) for micro-flow gradient generation has been directly fabricated within 125 minutes by using the positive-tone PDMS. A small microfluidic chip with feature size as small as 5 μm is demonstrated by using the negative-tone PDMS. The experimental results reveal that the optical maskless lithography technology enables to rapidly pattern high-resolution microstructures and is very promising for development of lab-on-a-chip devices.
Description: 8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems; and Smart Structures and Materials, AOMATT 2016, Suzhou, China, 26-29 April 2016
ISBN: 9781628419207
ISSN: 0277-786X
EISSN: 1996-756X
DOI: 10.1117/12.2243464
Appears in Collections:Conference Paper

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