Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/65803
Title: Application of X-ray diffraction to study the grinding induced surface damage mechanism of WC/Co
Authors: Zhang, Q
Zhao, Q
To, S 
Guo, B
Keywords: Compressive stress
Grinding
Preferred orientation
WC/Co
X-ray diffraction
Issue Date: 2017
Publisher: Elsevier
Source: International journal of refractory metals & hard materials, 2017, v. 64, p. 205-209 How to cite?
Journal: International journal of refractory metals & hard materials 
Abstract: X-ray diffraction was utilized to examine the WC/Co surface after high spindle speed grinding (HSSG) to get a further insight into the machining induced surface damage mechanism. The results showed that grinding induced reorientation and preferred {100}/{10 −10} growth of WC particles occurred in the deformed surface, while the crystallinity of WC(001) increased. Based on the analysis of the penetration depth of X ray in WC and Co, grazing incidence X-ray diffraction (GIXRD) showed that the grinding induced preferred crystal growth occurred only in the outmost layer (~ 3.324 nm), but the compressive stress was caused to a certain depth of the subsurface (> 756.18 nm).
URI: http://hdl.handle.net/10397/65803
ISSN: 0263-4368
DOI: 10.1016/j.ijrmhm.2016.11.006
Appears in Collections:Journal/Magazine Article

Access
View full-text via PolyU eLinks SFX Query
Show full item record

SCOPUSTM   
Citations

1
Last Week
0
Last month
Citations as of Sep 21, 2018

Page view(s)

38
Last Week
0
Last month
Citations as of Sep 17, 2018

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.