Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/64405
Title: Investigation of factors affecting and optimizing material removal rate in computer controlled ultra-precision polishing
Authors: Ho, LT
Cheung, CF 
Blunt, L
Zheng, SY
Keywords: ANOVA
Computer Controlled Polishing
Mechanical Polishing
Process Optimization
Taguchi Method
Ultra-Precision Machining
Issue Date: 2015
Publisher: Scientific.Net
Source: Key engineering materials, 2015, v. 625, p. 446-452 How to cite?
Journal: Key engineering materials 
Abstract: There are numerous parameters and steps involved in a computer controlled ultra-precision polishing process (CCUP). The success of CCUP relies heavily on the understanding and optimization of material removal when new materials and new surfaces are polished. It is crucial to optimize the polishing parameters to enhance the effectiveness of the polishing process and to assess the impact of different process parameters on the material removal rate of particular difficult-to-machine materials such as CoCr alloys, which is commonly used in orthopedic implants. This paper aims at studying the process parameters and optimization of the parameter to enhance the material removal rate and quantify the contribution of process parameters.
Description: The 5th International Conference on Asian Society for Precision Engineering and Nanotechnology (ASPEN 2013), November 12-15, 2013, Taipei, Taiwan
URI: http://hdl.handle.net/10397/64405
ISSN: 1013-9826
EISSN: 1662-9795
DOI: 10.4028/www.scientific.net/KEM.625.446
Appears in Collections:Conference Paper

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