Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/64047
Title: RoHs & WEEE : status, compliance, issues and implications
Authors: Chan, YC
Lam , HSB
Yung, KC 
Chau, PWL
Pecht, M
Beullens , P
Hammond, D
Issue Date: 2006
Publisher: Centre for Electronic Packaging and Assemblies, Failure Analysis and Reliability Engineering
Source: Chan, YC, Lam , HSB, Yung, KC, Chau, PWL, Pecht, M, Beullens , P & Hammond, D. RoHs & WEEE : status, compliance, issues and implications. Hong Kong: Centre for Electronic Packaging and Assemblies, Failure Analysis and Reliability Engineering, 2006 How to cite?
Series/Report no.: Green Manufacturing Book Series
URI: http://hdl.handle.net/10397/64047
ISBN: 9624422788 (pbk.)
Appears in Collections:Book

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