Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/5986
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dc.contributorDepartment of Applied Physics-
dc.creatorKwok, KW-
dc.creatorLee, T-
dc.creatorChoy, SH-
dc.creatorChan, HLW-
dc.date.accessioned2014-12-11T08:23:16Z-
dc.date.available2014-12-11T08:23:16Z-
dc.identifier.isbn978-953-307-122-0-
dc.identifier.urihttp://hdl.handle.net/10397/5986-
dc.language.isoenen_US
dc.publisherInTechen_US
dc.rightsThe article is licensed under a Creative Commons Attribution-NonCommercial-ShareAlike 3.0 Unported (CC BY-NC-SA 3.0) <http://creativecommons.org/licenses/by-nc-sa/3.0/>en_US
dc.subjectLead-free piezoelectric transducersen_US
dc.titleLead-free piezoelectric transducers for microelectronic wirebonding applicationsen_US
dc.typeBook Chapteren_US
dc.description.otherinformationAuthor name used in this publication: K. W. Kwoken_US
dc.description.otherinformationAuthor name used in this publication: S. H. Choyen_US
dc.description.otherinformationAuthor name used in this publication: H. L. W. Chanen_US
dc.identifier.doi10.5772/9944-
dcterms.abstractIn this chapter, the use of (K₀.₄₇₅Na₀.₄₇₅Li₀.₀₅)(Nb₀.₉₂Ta₀.₀₅Sb₀.₀₃)O₃ added with 0.4wt% CeO₂ and 0.4wt% MnO₂ (abbreviated KNLNTS) and 0.885(Bi₀.₅Na₀.₅)TiO₃-0.05(Bi₀.₅K₀.₅)TiO₃-0.015(Bi₀.₅ Li₀.₅)TiO₃-0.05BaTiO₃ (abbreviated as BNKLBT) lead-free piezoelectric ceramics as the driving elements of ultrasonic wirebonding transducers is reported. The fabrication and characterization of the ceramics, in the form of ring, and the wirebonding transducers are presented.-
dcterms.accessRightsopen accessen_US
dcterms.bibliographicCitationIn E Suaste-Gomez (Ed.), Piezoelectric ceramics, p. 145-164. InTech, 2010-
dcterms.issued2010-05-10-
dc.relation.ispartofbookPiezoelectric ceramics-
dc.identifier.rosgroupidr51945-
dc.description.ros2010-2011 > Academic research: refereed > Chapter in an edited book (author)-
dc.description.oaVersion of Recorden_US
dc.identifier.FolderNumberOA_IR/PIRAen_US
dc.description.pubStatusPublisheden_US
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