Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/5980
Title: Method and system for bonding electrical devices using an electrically conductive adhesive
Other Titles: 一种使用导电粘合剂粘接电气设备的方法及系统
Authors: Or, DSW 
Issue Date: 6-Mar-2013
Publisher: 中华人民共和国国家知识产权局
Source: 中国专利 ZL 201010262578.6 How to cite?
Abstract: A system for bonding electrical devices (13, 15) using an electrically conductive adhesive (14) to adhere the electrical devices (13, 15) together, the system (10) comprising: an ultrasonic transducer (11) to generate an ultrasonic vibration; and an ultrasonic to thermal energy apparatus (20) operatively attached to and covering an operational end (12) of the ultrasonic transducer (11), the ultrasonic to thermal energy apparatus (20) damping the ultrasonic vibration to minimize ultrasonic vibration transmitted to a first electrical device (13) and causing the conversion of the ultrasonic vibration to a heating pulse which is conducted through the first electrical device (13) to the adhesive (14); wherein the adhesive (14) is softened by the heating pulse to bond the electrical devices (13, 15) together.
一种用于粘接电气设备(13、15)的系统(10),其使用导电粘合剂(14)将电气设备(13、15)粘附在一起。所述系统(10)包括:产生超声波振动的超声换能器(11)和操作性地连接并覆盖所述超声换能器(11)的操作端(12)的超声波-热能装置(20),所述超声波-热能装置(20)阻尼所述超声波振动以使传递至第一电气设备(13)的超声波振动最小,并使超声波振动转换为热脉冲,所述热脉冲通过所述第一电气设备(13)传导至所述粘合剂(14),其中,所述粘合剂(14)被所述热脉冲软化从而将所述电气设备(13、15)粘接在一起。
URI: http://hdl.handle.net/10397/5980
Rights: 专利权人: The Hong Kong Polytechnic University.
Appears in Collections:Patent

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