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Title: Performance study of an ultrasonic transducer used for wire bonding
Authors: Or, DSW 
Chan, HLW 
Lo, VC
Yuen, CW
Keywords: Ultrasonic transducer
Wire bonding
Piezoelectric transducers
Finite element method
Issue Date: 1998
Publisher: IEEE
Source: 1998 IEEE Hong Kong Electron Devices Meeting : 29 August 1998, Hong Kong University of Science and Technology : proceedings, p. 161-164 How to cite?
Abstract: In-situ studies on the performance of an ultrasonic wire-bonding transducer (about 60 kHz) are presented and discussed in this paper in order to optimize the bonding process. The resonant frequencies and vibration mode shapes of the transducer were computed using finite element method (FEM) and were compared with the experimental resonant frequencies and displacement distributions. Good agreements between the computed and experimental results were obtained. The desirable second axial mode was found and proven to be the dominant mode of the transducer that facilitates the bonding process. Characteristics of the transducer under different input power were also studied. Results show that its performance is good and high quality bonds can be formed.
ISBN: 0-7803-4932-6
Rights: © 1998 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
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