Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/58293
Title: Concurrent mold and process design of transfer molding for electronic packages using process simulation and design of experiments techniques
Authors: Ip, KW
Kwong, CK 
Issue Date: 2002
Publisher: AA Balkema
Source: In R Goncalves & R Roy (Eds.), 9th ISPE International Conference on Concurrent Engineering : Research and Applications, Cranfield, UK, 27-31 July 2002, p. 145-151. Abingdon : A.A. Balkema, 2002 How to cite?
URI: http://hdl.handle.net/10397/58293
Appears in Collections:Conference Paper

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