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Title: A tripartite partnership to elevate technology advancement of Hong Kong PCB and substrate industries
Authors: Yung, KC 
Issue Date: 2001
Source: The 4th International Academic Conference on Electronic Packaging Research, Education and Training for the New Millennium, CityU, 5 March 2001, p. 6-7 How to cite?
Description: Invited conference paper
Appears in Collections:Conference Paper

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