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Title: Residual stress in a polymer-glued FBG temperature-compensated sensor for civil engineering applications
Authors: Lau, KT 
Au, HY
Ling, HY
Chan, PKC
Issue Date: 2006
Source: Proceedings The International Conference on Experimental Mechanics, Korea, 26-29 September 2006, p. 789-793 How to cite?
Appears in Collections:Conference Paper

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