Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/572
Title: TSDC measurements of underfill encapsulant used in microelectronic packaging
Authors: Cheng, KC
Peng, Z
Wong, CS
Chan, HLW 
Keywords: Activation energy
Aluminum
Dielectric relaxation
Differential scanning calorimetry
Electric current measurement
Electric properties
Electronics packaging
Glass transition
Microelectronic processing
Temperature
Issue Date: 2002
Publisher: IEEE
Source: 11th International Symposium on Electrets (ISE 11) : 1-3 October, 2002, Glen Waverley, Melbourne, Australia : proceedings, p. 71-74 How to cite?
Abstract: The thermal stimulated depolarization current (TSDC) technique was used to study the dielectric relaxation of underfill encapsulant used in microelectronic packaging. The dependence of electrical properties of the underfill on the polarizing temperature, polarizing field and heating rate were analyzed from the TSDC spectra as a function of temperature. A single α-relaxation peak associated with the glass transition temperature T[sub g] of the underfill was observed. A value of Tg can be estimated which can be compared to the T[sub g] determined by differential scanning calorimetry (DSC). The activation energy and relaxation time of the dielectric relaxation of the underfill were determined from the TSDC measurements.
URI: http://hdl.handle.net/10397/572
ISBN: 0-7803-7560-2
Rights: © 2002 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
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