Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/54365
Title: Nanosolder for low temperature lead-free electronic interconnect applications
Authors: Yung, WKC 
Lee, CP
Pang, SK
Keywords: Lead-free electronics manufacturing processes
Solder and soldering
Issue Date: 2011
Publisher: PCB Technology Centre, Dept. of Industrial and Systems Engineering, The Hong Kong Polytechnic University
Source: Yung, WKC, Lee, CP & Pang, SK. Nanosolder for low temperature lead-free electronic interconnect applications. Hong Kong: PCB Technology Centre, Dept. of Industrial and Systems Engineering, The Hong Kong Polytechnic University, 2011 How to cite?
URI: http://hdl.handle.net/10397/54365
ISBN: 988189591X (pbk.)
9789881895912 (pbk.)
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