Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/50170
Title: Room-temperature ultrasonic bonding of semiconductor thin dies with die attach films on glass substrates
Authors: Or, SW 
Wong, SY
Wong, HC
Cheung, YM
Choy , PK
Issue Date: 2008
Source: Proceedings the 29th Symposium on Ultrasonic Electronics, Sendai City Silver Center, Sendai, Japan, 11-13 November 2008, p. 319-320 How to cite?
URI: http://hdl.handle.net/10397/50170
Appears in Collections:Conference Paper

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