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|Title:||Room-temperature ultrasonic bonding of semiconductor thin dies with die attach films on glass substrates||Authors:||Or, SW
Choy , PK
|Issue Date:||2008||Source:||Proceedings the 29th Symposium on Ultrasonic Electronics, Sendai City Silver Center, Sendai, Japan, 11-13 November 2008, p. 319-320 How to cite?||URI:||http://hdl.handle.net/10397/50170|
|Appears in Collections:||Conference Paper|
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