Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/49423
Title: Piezocomposite ultrasonic transducer for high-frequency wire-bonding of microelectronics devices
Authors: Or, SW 
Chan, HLW 
Liu, PCK
Issue Date: 2005
Source: Proceedings of the 26th Symposium on Ultrasonic Electronics, Yokohama, Japan, 16-18 November 2005, p. 201-202 How to cite?
URI: http://hdl.handle.net/10397/49423
Appears in Collections:Conference Paper

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