Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/4879
DC FieldValueLanguage
dc.contributorDepartment of Mechanical Engineering-
dc.creatorHuang, H-
dc.creatorWoo, CH-
dc.creatorWei, HL-
dc.creatorZhang, XX-
dc.date.accessioned2014-12-11T08:24:48Z-
dc.date.available2014-12-11T08:24:48Z-
dc.identifier.issn0003-6951-
dc.identifier.urihttp://hdl.handle.net/10397/4879-
dc.language.isoenen_US
dc.publisherAmerican Institute of Physicsen_US
dc.rights© 2003 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The following article appeared in H. Huang et al., Appl. Phys. Lett. 82, 1272 (2003) and may be found at http://link.aip.org/link/?apl/82/1272en_US
dc.subjectCopperen_US
dc.subjectMetallic thin filmsen_US
dc.subjectSurface structureen_US
dc.subjectSputter depositionen_US
dc.subjectMolecular dynamics methoden_US
dc.subjectNanostructured materialsen_US
dc.subjectScanning electron microscopyen_US
dc.subjectX-ray diffractionen_US
dc.subjectSurface diffusionen_US
dc.subjectSurfactantsen_US
dc.subjectConformal coatingsen_US
dc.titleKinetics-limited surface structures at the nanoscaleen_US
dc.typeJournal/Magazine Articleen_US
dc.description.otherinformationAuthor name used in this publication: C. H. Wooen_US
dc.identifier.spage1-
dc.identifier.epage3-
dc.identifier.volume82-
dc.identifier.issue8-
dc.identifier.doi10.1063/1.1555278-
dcterms.abstractThis letter presents the evolution of kinetics-limited nanoscale structures during copper thin film deposition. We first calculate the three-dimensional Ehrlich–Schwoebel (3D ES) kinetic barrier of copper using the molecular dynamics/statics method. Based on this calculation, the dimension of {111} facets, under typical sputtering deposition conditions, is estimated to be 700 nm if the 3D ES barrier is effective, in contrast to 70 μm without it. Accompanying the calculations, we deposit copper 〈111〉 columns using the magnetron sputtering technique, and characterize their structures using scanning electron microscopy and x-ray diffraction techniques. The observed facets of pure copper films are on the order of 200 nm in dimension, confirming that surface structure is controlled by the 3D ES kinetic barrier. When indium is introduced as surfactant, the facet dimension increases, leading to conformal films; this is attributed to reduction of the 3D ES barrier.-
dcterms.bibliographicCitationApplied physics letters, 24 Feb. 2003, v. 82, no. 8, 1272, p. 1-3-
dcterms.isPartOfApplied physics letters-
dcterms.issued2003-02-24-
dc.identifier.isiWOS:000181066000044-
dc.identifier.scopus2-s2.0-0037463294-
dc.identifier.eissn1077-3118-
dc.identifier.rosgroupidr13176-
dc.description.ros2002-2003 > Academic research: refereed > Publication in refereed journal-
dc.description.oapublished_final-
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