Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/482
Title: Piezoelectric micromachined ultrasonic transducers based on P(VDF-TrFE) copolymer thin films
Authors: Chao, C
Lam, TY
Kwok, KW 
Chan, HLW 
Keywords: Piezoelectric thin filmrray
Ultrasonic transducer array
Micromachining
Issue Date: 2006
Publisher: IEEE
Source: ISAF 2006 : prodeedings of the 15th IEEE International Symposium on Applications of Ferroelectrics, Sunset Beach, North Carolina, USA, July 31-August 02, 2006, p. 120-123 How to cite?
Abstract: Representing a new approach to ultrasound generation and detection, study on piezoelectric micromachined ultrasonic transducers (pMUTs) has been a growing research area in recent years. Intensive research work has been directed on the deposition of lead zirconate titanate (PZT) films on silicon substrates for their excellent piezoelectric coefficients and electromechanical coupling coefficients. However, the high processing temperature required for PZT crystallization results in a low device yield and also makes it difficult to integrate with control circuits. In this paper, a fabrication technology of pMUTs based on piezoelectric P(VDF-TrFE) 70/30 copolymer films has been adopted, with the maximum processing temperature not exceeding 140°C allowing for post-IC compatibility. The entire processing procedures are simple and low cost, as compared with those of capacitive micromachined ultrasonic transducers (cMUTs) and ceramic-based pMUTs. The applications of the fabricated pMUTs as airborne ultrasonic transducers and transducer arrays have been demonstrated. Reasonably good device performances and high device yield have been achieved.
URI: http://hdl.handle.net/10397/482
ISBN: 142441332X
ISSN: 1099-4734
Rights: © 2006 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
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