Please use this identifier to cite or link to this item:
|Title:||Study of the tensile strength of nanostructured copper obtained by electrodeposition and SMAT|
|Source:||Proceedings of IMECE 2007, Seattle, Washington, 11-15 November 2007 (CD-ROM) How to cite?|
|Appears in Collections:||Conference Paper|
Show full item record
Checked on Jan 22, 2017
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.