Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/47585
Title: Study of the tensile strength of nanostructured copper obtained by electrodeposition and SMAT
Authors: Chan, HL
Lu, J
Issue Date: 2007
Source: Proceedings of IMECE 2007, Seattle, Washington, 11-15 November 2007 (CD-ROM) How to cite?
URI: http://hdl.handle.net/10397/47585
Appears in Collections:Conference Paper

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