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Title: Numerical simulation of heat and moisture transfer in porous walls with micro-encapsulated PCM
Authors: Li, Y 
Wang, XC
Li, S
Niu, JM
Issue Date: 2005
Source: 17th IMACS World Congress : Scientific Computation, Applied Mathematics and Simulation, Paris, France, 11-15 Jul 2005 (VCD) How to cite?
Appears in Collections:Conference Paper

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