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Title: Ultrasonic bonding of die attach film (DAF)-laminated thin silicon dies on glass substrates at room temperature
Authors: Wong, SY
Wong, HC
Or, SW 
Cheung, YM
Choy, PK
Issue Date: 2008
Source: Proceedings the 10th Electronics Packaging Technology Conference (EPTC 2008), Grand Copthorne Waterfront Hotel, Singapore, 9-12 December 2008 How to cite?
Appears in Collections:Conference Paper

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