Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/46692
Title: Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages
Authors: Gain, AK
Chan, YC
Yung, KC 
Issue Date: 2008
Source: Proceedings of 2nd Electronic System-Integration Technology Conference (ESTC 2008), Greenwich, London, UK, 1-4 Sept 2008, UK, p. 1291-1294 How to cite?
URI: http://hdl.handle.net/10397/46692
Appears in Collections:Conference Paper

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