Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/46689
Title: Effect of small Sn-3.5Ag-0.5Cu additions to Sn-8Zn-3Bi solder on interfacial microstructure and properties with ball grid array packages
Authors: Gain, AK
Chan, YC
Yung, WKC 
Sharif, A
Issue Date: 2009
Source: Proceedings of The 59th Electronic Components and Technology Conference, 2009 (ECTC '09), USA, May 2009, p. 1-8 How to cite?
URI: http://hdl.handle.net/10397/46689
Appears in Collections:Conference Paper

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