Please use this identifier to cite or link to this item:
Title: Effect of small Sn-3.5Ag-0.5Cu additions to Sn-8Zn-3Bi solder on interfacial microstructure and properties with ball grid array packages
Authors: Gain, AK
Chan, YC
Yung, WKC 
Sharif, A
Issue Date: 2009
Source: Proceedings of The 59th Electronic Components and Technology Conference, 2009 (ECTC '09), USA, May 2009, p. 1-8 How to cite?
Appears in Collections:Conference Paper

Show full item record

Page view(s)

Last Week
Last month
Citations as of Mar 18, 2018

Google ScholarTM


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.