Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/43874
Title: Element diffusion model of bimetallic hot deformation in metallurgical bonding process
Authors: Sun, CY
Li, L
Fu, MW 
Zhou, QJ
Keywords: Bimetal
Element diffusion
Metallurgical bonding process
Modeling
Issue Date: 2016
Publisher: Elsevier
Source: Materials and design, 2016, v. 94, p. 433-443 How to cite?
Journal: Materials and design 
Abstract: The effect of process parameters on the diffusion behavior of different elements in the metallurgical bonding process of bimetallic hot deformation is investigated. The diffusion distance of different elements increases with the effective strain, deformation and holding temperatures, deformation and holding times. On the other hand, it decreases with the increase of effective strain rate. In addition, an element diffusion model considering the influences of different processing parameters on element diffusion behavior is proposed to predict element concentration values near the metallurgical bonding interface. The proposed element diffusion model is based on the Fick's second law for unidirectional flow under non-steady state condition and is applied to the finite element simulation to investigate the diffusion behavior of different elements in metallurgical bonding process. The study shows that the modified model can predict the concentration profile and diffusion distance in the transition zone with a higher accuracy compared with the reference element diffusion model without considering the effects of effective strain and strain rate.
URI: http://hdl.handle.net/10397/43874
ISSN: 0264-1275 (print)
1873-4197 (online)
0261-3069
DOI: 10.1016/j.matdes.2016.01.058
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