Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/43873
Title: Surface damage mechanism of WC/Co and RB-SiC/Si composites under high spindle speed grinding (HSSG)
Authors: Zhang, Q
To, S 
Zhao, Q
Guo, B
Keywords: Fracture
High spindle speed grinding (HSSG)
Plastic deformation
Surface finish
Vibration
Issue Date: 2016
Publisher: Elsevier
Source: Materials and design, 2016, v. 92, p. 378-386 How to cite?
Journal: Materials and design 
Abstract: The surface damage mechanisms of WC/Co and Reaction-bonded SiC/Si (RB-SiC/Si) composites under high spindle speed grinding (HSSG) were investigated in the present work. Sharp edge loss and grit splintering were identified as two typical diamond wheel wear mechanisms. Plastic scratching grooves, Co extrusion and WC dislodgement were generated on the machined surface of WC/Co after grinding, while micro-pits of varied sizes at the phase boundaries and plastic scratching grooves were the main surface characteristics for RB-SiC/Si. Moreover, it was found that non-uniform surface finish at different radial positions resulted from the increase in material removal rate for both WC/Co and RB-SiC/Si, and the simulated results based on Soneys' model mostly corresponded with the measured outcomes. In addition, obvious relative wheel-workpiece vibration induced surface waviness was found, and its effect on the surface profile was analyzed for the wheel edge profile considered, which differed with that from single point diamond machining (SPDT).
URI: http://hdl.handle.net/10397/43873
ISSN: 0264-1275 (print)
1873-4197 (online)
0261-3069
DOI: 10.1016/j.matdes.2015.12.055
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