Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/38926
Title: Comparison of bonding defects for longitudinal and transverse thermosonic flip-chip
Authors: Li, HL
Chan, HLW 
Liu, PCK
Issue Date: 2003
Source: International Conference on Materials for Advanced Technologies (ICMAT 2003) and International Conference in Asia 2003 (IUMRS-ICA 2003), Singapore, 7-12 December 2003, p. 350-355 How to cite?
URI: http://hdl.handle.net/10397/38926
Appears in Collections:Conference Paper

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