Please use this identifier to cite or link to this item:
Title: Comparison of bonding defects for longitudinal and transverse thermosonic flip-chip
Authors: Li, HL
Chan, HLW 
Liu, PCK
Issue Date: 2003
Source: International Conference on Materials for Advanced Technologies (ICMAT 2003) and International Conference in Asia 2003 (IUMRS-ICA 2003), Singapore, 7-12 December 2003, p. 350-355 How to cite?
Appears in Collections:Conference Paper

Show full item record

Page view(s)

Last Week
Last month
Checked on Aug 20, 2017

Google ScholarTM


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.