Please use this identifier to cite or link to this item:
Title: Piezocomposite ultrasonic transducers for microelectronic wire bonding application
Authors: Or, SW 
Chan, HLW 
Liu, PCK
Issue Date: 2004
Source: First International Workshop on Advanced Smart Materials and Smart Structures Technology, Hawaii, USA, 12-14 January 2004, p. 531-538
Appears in Collections:Conference Paper

Show full item record

Page view(s)

Last Week
Last month
Citations as of Sep 15, 2020

Google ScholarTM


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.