Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/38401
Title: Piezocomposite ultrasonic transducers for microelectronic wire bonding application
Authors: Or, SW 
Chan, HLW 
Liu, PCK
Issue Date: 2004
Source: First International Workshop on Advanced Smart Materials and Smart Structures Technology, Hawaii, USA, 12-14 January 2004, p. 531-538 How to cite?
URI: http://hdl.handle.net/10397/38401
Appears in Collections:Conference Paper

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