Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/377
Title: Characterization of piezoelectric ring used for wire bonding transducer application
Authors: Cheng, KC
Chan, HLW 
Keywords: Piezoelectric
Ring
Electromechanical
Transducer
Issue Date: 2001
Publisher: IEEE
Source: 2001 IEEE Hong Kong Electron Devices Meeting : proceedings : 30 June 2001, The Hong Kong Polytechnic University, p. 64-67 How to cite?
Abstract: Resonant vibration modes excited in a piezoelectric PZT ring which is closely related to its geometry and dimensions were studied. By a thinning test of the ring, the electromechanical properties of the ring were measured as a function of its thickness and shifts in resonance vibrations were noted. Thickness of the ring was also optimized in relation to the electromechanical performance of the ring used for wire bonding application.
URI: http://hdl.handle.net/10397/377
ISBN: 0-7803-6714-6
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