Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/37019
Title: Ultrasonic bonding of semiconductor dies on glass substrates with thermoplastic adhesive tapes
Authors: Wong, HC
Wong, SY
Or, SW 
Cheung, YM
Choy, PK
Issue Date: 2007
Source: International Symposium on Smart Materials and Devices, Hong Kong, China, 10-11 December 2007, p. 98 How to cite?
URI: http://hdl.handle.net/10397/37019
Appears in Collections:Conference Paper

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