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http://hdl.handle.net/10397/35576
Title: | A power and thermal-aware virtual machine allocation mechanism for Cloud data centers | Authors: | Wang, JV Cheng, CT Tse, CK |
Issue Date: | 2015 | Source: | 2015 IEEE International Conference on Communication Workshop, ICCW 2015, 8-12 June 2015, p. 2850-2855 | Abstract: | With the rapid growing number of Cloud applications, demands for large-scale data centers have raised to historical high. Cloud data centers allow dynamic and flexible resource provisioning to accommodate time varying computational demands. Recent studies have proposed several allocation policies based mainly on power consumption of servers. Host temperature, however, is rarely considered as a monitoring parameter. This work proposes a power and thermal-aware virtual machine (VM) allocation mechanism for Cloud data centers. The objective of the proposed mechanism is to reduce the overall energy consumption and VM migration numbers, while avoiding violations of Service Level Agreements (SLA) in Cloud data centers. The proposed mechanism was implemented and evaluated on CloudSim. Simulation results show that the proposed allocation mechanism brings significant benefits in terms of energy saving and other performance indices. | Keywords: | Cloud Computing Data Centers Energy Consumption Thermal Aware Virtualization |
Publisher: | Institute of Electrical and Electronics Engineers Inc. | ISBN: | 9781467363051 | DOI: | 10.1109/ICCW.2015.7247611 | Rights: | © 2015 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The following publication J. V. Wang, C. T. Cheng and C. K. Tse, "A power and thermal-aware virtual machine allocation mechanism for Cloud data centers," 2015 IEEE International Conference on Communication Workshop (ICCW), London, 2015, pp. 2850-2855 is available at http://dx.doi.org/10.1109/ICCW.2015.7247611 |
Appears in Collections: | Conference Paper |
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Wang_Power_Thermal-aware_Virtual.pdf | Pre-published version | 105.9 kB | Adobe PDF | View/Open |
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