Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/35029
Title: The effect of waveform for pulse plating on copper plating distribution of microvia in PCB manufacture
Authors: Yung, KC 
Chan, KC 
Yue, TM 
Yeung, KF
Keywords: Pulse plating
Printed circuit boards
Microvia
Throwing power
Waveform
Issue Date: 2004
Publisher: Springer
Source: International journal of advanced manufacturing technology, 2004, v. 23, no. 3-4, p. 245-248 How to cite?
Journal: International journal of advanced manufacturing technology
Abstract: The application of microvias is to reduce the size and weight of the printed circuit board, and to enhance its electrical performance. In many instances, the plating of microvias creates a bottleneck for High Density Interconnection (HDI) manufacture. In this study, the effects of waveform on the copper plating process were investigated. The results showed that the addition of a spike, and a decrease in forward current can improve the throwing power in plating quality. The study also found that the combination of multiple spikes, a low forward current and a high reverse current can significantly improve copper distribution in microvias plating.
URI: http://hdl.handle.net/10397/35029
ISSN: 0268-3768 (print)
1433-3015 (online)
DOI: 10.1007/s00170-003-1667-1
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