Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/34902
Title: Placement of piezoelectric ceramic sensors in ultrasonic wire-bonding transducers
Authors: Chu, PWP
Chong, CP
Chan, HLW 
Ng, KMW
Liu, PCK
Keywords: Smart transducer
Wire bonding quality monitoring
PZT sensor
Wire-bond
Issue Date: 2003
Publisher: Elsevier
Source: Microelectronic engineering, 2003, v. 66, no. 1-4, p. 750-759 How to cite?
Journal: Microelectronic engineering 
Abstract: Three identical lead zirconate titanate (PZT) sensor rings have been inserted in different locations of an ultrasonic wire bonding transducer driver in order to measure the bonding parameters. Voltage outputs from these three sensors were compared in order to find an optimal position for the sensor placement. One side of the PZT sensor ring is partially coated with a specially designed electrode pattern and the rings are only poled in this small region. With this specific electrode pattern, sensor resonance can be eliminated and the sensor has a flat frequency response. From the sensor signals, different bonding qualities can be distinguished. Hence, the transducer can provide a feedback for real-time bond quality control and thus can be called a ‘smart transducer’. The optimum position is found to be near the back of the transducer if second harmonic detection is used. By placing the sensor at this optimized position, an in situ automatic wire bonding process control system can be implemented.
URI: http://hdl.handle.net/10397/34902
ISSN: 0167-9317
EISSN: 1873-5568
DOI: 10.1016/S0167-9317(02)00995-4
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