Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/34137
Title: Effect of Ag micro-particles content on the mechanical strength of the interface formed between Sn-Zn binary solder and Au/Ni/Cu bond pads
Authors: Das, SK
Sharif, A
Chan, YC
Wong, NB
Yung, WKC 
Keywords: Composite solder
Interfacial reaction
Mechanical property
Micro-particle
Sn-Zn eutectic solder
Thermal behavior
Issue Date: 2009
Publisher: Elsevier
Source: Microelectronic engineering, 2009, v. 86, no. 10, p. 2086-2093 How to cite?
Journal: Microelectronic engineering 
Abstract: In this study, addition of Ag micro-particles with a content in the range between 0 and 4 wt.% to a Sn-Zn eutectic solder, were examined in order to understand the effect of Ag additions on the microstructural and mechanical properties as well as the thermal behavior of the composite solder formed. The shear strengths and the interfacial reactions of Sn-Zn micro-composite eutectic solders with Au/Ni/Cu ball grid array (BGA) pad metallizations were systematically investigated. Three distinct intermetallic compound (IMC) layers were formed at the solder interface of the Au/electrolytic Ni/Cu bond pads with the Sn-Zn composite alloys. The more Ag particles that were added to the Sn-Zn solder, the more Ag-Zn compound formed to thicken the uppermost IMC layer. The dissolved Ag-Zn IMCs formed in the bulk solder redeposited over the initially formed interfacial Au-Zn IMC layer, which prevented the whole IMC layer lifting-off from the pad surface. Cross-sectional studies of the interfaces were also conducted to correlate with the fracture surfaces.
URI: http://hdl.handle.net/10397/34137
ISSN: 0167-9317
EISSN: 1873-5568
DOI: 10.1016/j.mee.2009.01.087
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