Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/33194
Title: Synthesis and cryogenic properties of polyimide-silica hybrid films by sol-gel process
Authors: Zhang, YH
Li, Y 
Fu, SY
Xin, JH 
Daoud, WA
Li, LF
Keywords: Cryogenic properties
Hybrid film
Polyimide
Issue Date: 2005
Publisher: Elsevier
Source: Polymer, 2005, v. 46, no. 19 SPEC. ISS., p. 8373-8378 How to cite?
Journal: Polymer (United Kingdom) 
Abstract: Polyimide-silica hybrid films were prepared from tetraethoxysilane (TEOS) and polyamic acid (PAA) via sol-gel process in the solution of N,N-dimethylacetamide (DMAc). The cryogenic mechanical and electrical properties of polyimide-silica hybrid films were studied taking into account the effects of silica content. The results indicated that the cryogenic modulus increased with the increase of silica content while the tensile strength and failure strain had a maximum value at proper silica contents. Moreover, the tensile strength and modulus of the hybrid films at cryogenic temperature (77 K) were obviously higher than those at room temperature, while the failure strain of the hybrid films was much lower at cryogenic temperature (77 K) than that at room temperature. The mean electrical breakdown strength of the hybrid films was shown to range from 151 to 225 kV/mm at cryogenic temperature (77 K).
URI: http://hdl.handle.net/10397/33194
ISSN: 0032-3861
EISSN: 1873-2291
DOI: 10.1016/j.polymer.2005.07.012
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