Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/33150
Title: Role of cell surface components on Cu2+ adsorption by Pseudomonas putida 5-x isolated from electroplating effluent
Authors: Wang, L
Chua, H
Zhou, Q
Wong, PK
Sin, SN
Lo, WH 
Yu, PH
Keywords: Adsorption isotherm
Cell capsule
Cell envelopes
Cu2+ adsorption capacity
Peptidoglycan layer (PEG)
Pseudomonas putida
Issue Date: 2003
Publisher: Pergamon-Elsevier Science Ltd
Source: Water research, 2003, v. 37, no. 3, p. 561-568 How to cite?
Journal: Water Research 
Abstract: A Gram-negative bacterium Pseudomonas putida 5-x with high Cu2+ accumulating capability was isolated from electroplating effluent in Kwun Tong, Hong Kong. The pretreated cells without superficial layer-capsule, isolated cell envelopes and the separated peptidoglycan layer materials were obtained from fresh P. putida 5-x cells, their Cu2+ adsorption capacities and properties were compared with that of the fresh cells. Pretreatment by 0.1 mol L-1 HCl enhanced Cu2+ adsorption capacity due to the degradation of cell superficial layer-capsule of P. putida 5-x cells. Isolated cell envelopes possessed five times more Cu2+ adsorption capacity than that of fresh intact cell. The Cu2+ adsorption of separated peptidoglycan layer materials indicated that the peptidoglycan layer only played 10-15% part of the Cu2+ adsorption capacity, and implied other cell surface components such as outer membrane or inner membrane might play an important role in such high Cu2+ binding of the cell envelopes. The adsorption process of fresh cells, pretreated cells and cell envelopes of P. putida 5-x could be described with Freundlich isotherm, while the adsorption of Cu2+ by separated peptidoglycan layer materials was better described with Langmuir isotherm.
URI: http://hdl.handle.net/10397/33150
ISSN: 0043-1354
DOI: 10.1016/S0043-1354(02)00350-0
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