Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/33083
DC FieldValueLanguage
dc.contributorDepartment of Industrial and Systems Engineering-
dc.creatorTong, KW-
dc.creatorKwong, CK-
dc.date.accessioned2015-06-23T09:12:14Z-
dc.date.available2015-06-23T09:12:14Z-
dc.identifier.issn0960-3131-
dc.identifier.urihttp://hdl.handle.net/10397/33083-
dc.language.isoenen_US
dc.publisherWorld Scientific Publ Co Pte Ltden_US
dc.subjectCase based reasoningen_US
dc.subjectFuzzy retrievalen_US
dc.subjectMicrochip encapsulationen_US
dc.subjectProcess designen_US
dc.titleProcess design of microchip encapsulation : a case based reasoning with fuzzy retrieval approachen_US
dc.typeJournal/Magazine Articleen_US
dc.identifier.spage127-
dc.identifier.epage138-
dc.identifier.volume10-
dc.identifier.issue2-
dc.identifier.doi10.1142/S0960313100000113-
dcterms.abstractThe microelectronic industry continues to grow rapidly in size and importance. The industry has already reached the size of other major industries with sales of product and equipment totalling billions of dollars a year. Among all the options available for semiconductor assembly, plastic packaging by using epoxy based encapsulation process is less expensive and accounts for approximately 80% of the worldwide packaging share and this percentage is increasing. Microchip encapsulation based on transfer molding is one of the important processes of semiconductor manufacturing. Quality is heavily dependent on the encapsulation mold design, selection of molding compound and process parameter setting of encapsulation molding. In current practice, encapsulation mold design and parameter setting of the transfer molding are done manually in a trial-and-error manner which would result in long lead time for obtaining acceptable molding quality. In this paper, an artificial intelligence technique, Case Based Reasoning with Fuzzy Retrieval, is described to perform process design of microchip encapsulation from which a case based system for microchip encapsulation, named CBS-ME, was developed. The system aims to automate the design of the key elements of encapsulation molds, suggest process parameters for transfer molding and improve its own design know-how through a learning process. A validation test was performed and the system solutions were benchmarked with the solutions obtained from the actual molding. Deviation of the two sets of solutions for mold design parameter setting and process parameter setting are 3.5% and 6% respectively.-
dcterms.bibliographicCitationJournal of electronics manufacturing, 2000, v. 10, no. 2, p. 127-138-
dcterms.isPartOfJournal of Electronics Manufacturing-
dcterms.issued2000-
dc.identifier.isiWOS:000169094100005-
dc.identifier.scopus2-s2.0-0034196997-
dc.identifier.rosgroupidr05107-
dc.description.ros2000-2001 > Academic research: refereed > Publication in refereed journal-
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