Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/33083
Title: Process design of microchip encapsulation : a case based reasoning with fuzzy retrieval approach
Authors: Tong, KW
Kwong, CK 
Keywords: Case based reasoning
Fuzzy retrieval
Microchip encapsulation
Process design
Issue Date: 2000
Publisher: World Scientific Publ Co Pte Ltd
Source: Journal of electronics manufacturing, 2000, v. 10, no. 2, p. 127-138 How to cite?
Journal: Journal of Electronics Manufacturing 
Abstract: The microelectronic industry continues to grow rapidly in size and importance. The industry has already reached the size of other major industries with sales of product and equipment totalling billions of dollars a year. Among all the options available for semiconductor assembly, plastic packaging by using epoxy based encapsulation process is less expensive and accounts for approximately 80% of the worldwide packaging share and this percentage is increasing. Microchip encapsulation based on transfer molding is one of the important processes of semiconductor manufacturing. Quality is heavily dependent on the encapsulation mold design, selection of molding compound and process parameter setting of encapsulation molding. In current practice, encapsulation mold design and parameter setting of the transfer molding are done manually in a trial-and-error manner which would result in long lead time for obtaining acceptable molding quality. In this paper, an artificial intelligence technique, Case Based Reasoning with Fuzzy Retrieval, is described to perform process design of microchip encapsulation from which a case based system for microchip encapsulation, named CBS-ME, was developed. The system aims to automate the design of the key elements of encapsulation molds, suggest process parameters for transfer molding and improve its own design know-how through a learning process. A validation test was performed and the system solutions were benchmarked with the solutions obtained from the actual molding. Deviation of the two sets of solutions for mold design parameter setting and process parameter setting are 3.5% and 6% respectively.
URI: http://hdl.handle.net/10397/33083
ISSN: 0960-3131
DOI: 10.1142/S0960313100000113
Appears in Collections:Journal/Magazine Article

Access
View full-text via PolyU eLinks SFX Query
Show full item record

SCOPUSTM   
Citations

2
Last Week
0
Last month
0
Citations as of Aug 18, 2017

WEB OF SCIENCETM
Citations

2
Last Week
0
Last month
0
Citations as of Aug 21, 2017

Page view(s)

31
Last Week
1
Last month
Checked on Aug 21, 2017

Google ScholarTM

Check

Altmetric



Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.