Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/33077
Title: Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads
Authors: Fouzder, T
Shafiq, I
Chan, YC
Sharif, A
Yung, WKC 
Keywords: Ball grid array solder joints
Microstructure
Nano doping
Shearing force
Issue Date: 2011
Publisher: Elsevier
Source: Journal of alloys and compounds, 2011, v. 509, no. 5, p. 1885-1892 How to cite?
Journal: Journal of alloys and compounds 
Abstract: Nano-sized, nonreacting, noncoarsening SrTiO3 particles have been incorporated into Sn-3.0 wt% Ag-0.5 wt% Cu solder alloys and the interfacial microstructure and the shear strength on Au/Ni metallized Cu pads ball grid array substrates investigated as a function of the number of reflow cycles and aging time. At their interfaces, a scallop-shaped ternary Sn-Ni-Cu intermetallic compound layer was found in both plain Sn-Ag-Cu solder joints and solder joints containing SrTiO3 nano-particles, and the intermetallic compound layer thickness increased with the number of reflow cycles and aging time. After the addition of SrTiO3 nano-particles, in the solder ball region, a fine microstructure of AuSn4, Ag3Sn, Cu 6Sn5 intermetallic compounds appeared in the β-Sn matrix. In addition, the shear strength of solder joints containing SrTiO 3 nano-particles exhibited a consistently higher value than that of plain Sn-Ag-Cu solder joints due to a second phase dispersion strengthening mechanism as well as a refinement of the intermetallic compounds. The fracture surface of plain Sn-Ag-Cu solder joints exhibited a brittle fracture mode with a smooth surface while Sn-Ag-Cu solder joints containing SrTiO3 nano-particles showed ductile failure characteristics with rough dimpled surfaces.
URI: http://hdl.handle.net/10397/33077
ISSN: 0925-8388
DOI: 10.1016/j.jallcom.2010.10.081
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