Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/32576
Title: Dielectric properties of fluorine-containing polymethylsiloxane-imide films
Authors: Wang, H
Tao, X 
Newton, E
Keywords: Dielectric relaxation behavior
Electric conduction and kinetic characteristics
Fluorine-containing polysiloxane-imide
Ultralow dielectric constant
Issue Date: 2002
Source: High performance polymers, 2002, v. 14, no. 3, p. 271-283 How to cite?
Journal: High Performance Polymers 
Abstract: The dielectric properties, dielectric relaxation behavior, electric conduction and kinetic characteristics of fluorine-containing polysiloxane-imide were investigated. The fluorine-containing polyimide [6FDA + p-PDA] has a low dielectric constant of 3.04, compared to normal polyimides such as Upilex-S [BPDA + p-PDA] with a dielectric constant of 3.47, due to the addition of perfluoroalkyl groups into the polymer backbone, while fluorine-containing polysiloxane-imide (6FDA + siloxane) has the lowest dielectric constant of 2.43, which is less than 2.5. The introduction of siloxane groups on the fluoric polyimides provides the possibility of obtaining high-performance polyimides with ultralow dielectric constants. The dielectric relaxation spectra suggest that the fluorine-containing polysiloxane-imide (6FDA + siloxane) has a phase separation structure. As frequency increases, the α relaxation strengths decrease and the β relaxation strengths hardly change. The conduction study indicates that the β peak corresponds to the β dipolar relaxation whereas the α one is due to the conductive effects in the bulk and the α dipolar relaxation. The activation energy of the α transition decreases with increasing frequency, while the activation energy of the β transition does not vary with frequency.
URI: http://hdl.handle.net/10397/32576
ISSN: 0954-0083
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