Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/31410
Title: Investigation of small Sn-3.5Ag-0.5Cu additions on the microstructure and properties of Sn-8Zn-3Bi solder on Au/Ni/Cu pads
Authors: Gain, AK
Fouzder, T
Chan, YC
Sharif, A
Yung, WKC 
Keywords: Ball grid array solder joints
Microstructure
Multiple reflows
Pb-free
Shearing strength
Issue Date: 2010
Publisher: Elsevier
Source: Journal of alloys and compounds, 2010, v. 489, no. 2, p. 678-684 How to cite?
Journal: Journal of alloys and compounds 
Abstract: The formation of intermetallic compounds and the shear strength of Sn-Zn-Bi solder alloys with various (0, 1, 3, 5 and 7 wt%) weight percentages of Sn-Ag-Cu were investigated on Au/Ni metallized Cu pads depending on the number of reflow cycles. In Sn-Zn-Bi solder joints, scallop-shaped AuZn3 intermetallic compound (IMC) particles were found at the interfaces and in the solder ball regions, fine Bi- and needle-shaped Zn-rich phase were observed in the Sn matrix. After Sn-Ag-Cu additions, an additional Ag-Zn intermetallic compound layer was adhered to the top surface of the AuZn3 layer at the interface and fine spherical-shaped AgZn3 intermetallic compound particles were detected in the solder ball regions together with Bi- and Zn-rich phase volumes. After the addition of Sn-Ag-Cu, the shear strength of Sn-Zn-Bi solder joints increased due to the formation of the fine AgZn3 intermetallic compound particles. The shear strengths of Sn-Zn-Bi and Sn-Zn-Bi/7 wt% Sn-Ag-Cu solder joints after one reflow cycle were about 44.5 and 53.1 MPa, respectively and their shear strengths after eight reflow cycles were about 43.4 and 51.6 MPa, respectively.
URI: http://hdl.handle.net/10397/31410
ISSN: 0925-8388
DOI: 10.1016/j.jallcom.2009.09.150
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