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Title: An optimum spacing problem for five chips on a horizontal substrate in an enclosure - natural convection
Authors: Liu, Y 
Leung, CW 
Chang, TL 
Phan-Thien, N
Issue Date: 2000
Publisher: Imperial College Press
Source: International journal of computational engineering science, 2000, v. 1, no. 1, p. 167-186 How to cite?
Journal: International journal of computational engineering science 
Abstract: The optimum spacing problem for five heated chips rested on a conductive substrate in a two dimensional enclosure filled with air is solved by an operator-splitting pseudo-time-stepping finite element method, which automatically satisfies the continuity of the interfacial temperature and heat flux. It is found that the conventional equi-spaced arrangement is not an optimum option. An optimum thermal performance can be obtained when the center-to-center distances between the chips follow a geometric series. The maximum relative temperature drop in the optimum configuration can be as much as 17% of the equi-spaced arrangement.
ISSN: 1465-8763
DOI: 10.1142/S1465876300000094
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