Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/30108
Title: Initial process-parameters setting of transfer moulding in microchip encapsulation: A case-based reasoning approach
Authors: Tong, KW
Kwong, CK 
Chan, CY 
Keywords: Case-based reasoning
Fuzzy retrieval
Microchip encapsulation
Process-parameters setting
Transfer moulding
Issue Date: 2001
Publisher: Elsevier
Source: Journal of materials processing technology, 2001, v. 113, no. 1-3, p. 432-438 How to cite?
Journal: Journal of materials processing technology 
Abstract: Microchip encapsulation based on transfer moulding is one of the important processes of semiconductor manufacturing. This process involves numerous elements working together in order to produce a quality moulded product. Among all of these elements, process-parameters setting of transfer moulding in microchip encapsulation plays a vital role. Determination of the initial process-parameters for transfer moulding in microchip encapsulation is a highly skilled job, based on a skilled operators "know-how" and intuitive sense acquired through long-term experience rather than on a theoretical and analytical approach. Faced with global competition, the current trial-and-error practice in the determination of the initial process-parameters becomes inadequate. In this paper, an artificial intelligence technique, case-based reasoning, is introduced in the process-parameters setting of transfer moulding in microchip encapsulation, from which a case-based system has been developed. The system aims to suggest the proper initial process-parameters of transfer moulding and improve its own moulding know-how through a learning process. The system was implemented and validated in collaboration with a semiconductor equipment manufacturer. From the validation results, it was found that the process-parameters obtained from the case-based system are very close to those obtained from the company.
Description: 5th Asia Pacific Conference on Materials Processing, Seoul, 25-25 June 2001
URI: http://hdl.handle.net/10397/30108
ISSN: 0924-0136
EISSN: 1873-4774
DOI: 10.1016/S0924-0136(01)00603-3
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