Initial process-parameters setting of transfer moulding in microchip encapsulation: A case-based reasoning approach

Abstract

Microchip encapsulation based on transfer moulding is one of the important processes of semiconductor manufacturing. This process involves numerous elements working together in order to produce a quality moulded product. Among all of these elements, process-parameters setting of transfer moulding in microchip encapsulation plays a vital role. Determination of the initial process-parameters for transfer moulding in microchip encapsulation is a highly skilled job, based on a skilled operators "know-how" and intuitive sense acquired through long-term experience rather than on a theoretical and analytical approach. Faced with global competition, the current trial-and-error practice in the determination of the initial process-parameters becomes inadequate. In this paper, an artificial intelligence technique, case-based reasoning, is introduced in the process-parameters setting of transfer moulding in microchip encapsulation, from which a case-based system has been developed. The system aims to suggest the proper initial process-parameters of transfer moulding and improve its own moulding know-how through a learning process. The system was implemented and validated in collaboration with a semiconductor equipment manufacturer. From the validation results, it was found that the process-parameters obtained from the case-based system are very close to those obtained from the company.