Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/29060
Title: Effect of small Sn-3.5Ag-0.5Cu additions on the structure and properties of Sn-9Zn solder in ball grid array packages
Authors: Gain, AK
Chan, YC
Sharif, A
Yung, WKC 
Keywords: Ball grid array solder joints
Microstructure
Shearing force
Issue Date: 2009
Publisher: Elsevier Science Bv
Source: Microelectronic engineering, 2009, v. 86, no. 11, p. 2347-2353 How to cite?
Journal: Microelectronic Engineering 
Abstract: Sn-9Zn with various additions of Sn-3.5Ag-0.5Cu powder was prepared by mechanically dispersing different weight percentages (1, 3, 5 and 7) of Sn-Ag-Cu powder into Sn-9Zn solder paste. In the Sn-Zn solder, scallop-shaped AuZn3 intermetallic compound was found at the interfaces. On the other hand, in the Sn-3.5Ag-0.5Cu content solders, an additional ?`-AgZn3 intermetallic compound layer was found to be well adhered on the top surface of the AuZn3 layer and the ?`-AgZn3 layer thickness increased with the number of reflow cycles. In add
URI: http://hdl.handle.net/10397/29060
ISSN: 0167-9317
DOI: 10.1016/j.mee.2009.04.015
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