Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/29031
Title: An optimum spacing problem for three-by-three heated elements mounted on a substrate
Authors: Chen, S
Liu, Y 
Issue Date: 2002
Publisher: Springer
Source: Heat and mass transfer, 2002, v. 39, no. 1, p. 3-9 How to cite?
Journal: Heat and mass transfer 
Abstract: An experimental investigation has been carried out to determine the optimum spacing ratio among the heated elements in the cooling of electronic package. Three-by-three heated resistors with different spacing ratio are mounted on the substrate that in turn rests in a tunnel. The experimental results show that the conventional equi-spaced arrangement might not be the optimum option, and a better thermal performance could be obtained when the center-to-center distances between the resistors follow a geometric series. At Re = 800, when the spacing ratio among the heated resistors is 1.8, the highest temperature can decrease 8.24% and the temperature difference among resistors can reduce about 27.62% compared to that of the equi-spaced arrangement.
URI: http://hdl.handle.net/10397/29031
ISSN: 0947-7411
EISSN: 1432-1181
DOI: 10.1007/s00231-001-0286-3
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