Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/2902
DC Field | Value | Language |
---|---|---|
dc.contributor | Research Institute of Innovative Products and Technologies | - |
dc.creator | Cheng, CH | - |
dc.creator | Chao, C | - |
dc.creator | Zhu, Y | - |
dc.date.accessioned | 2011-03-03T10:40:06Z | - |
dc.date.available | 2011-03-03T10:40:06Z | - |
dc.identifier.uri | http://hdl.handle.net/10397/2902 | - |
dc.language.iso | en | en_US |
dc.rights | Assignee: The Hong Kong Polytechnic University. | en_US |
dc.title | Strain sensor | en_US |
dc.type | Patent | en_US |
dc.description.otherinformation | US7854173; US7854173 B2; US7854173B2; US7,854,173; US 7,854,173 B2; 7854173; Appl. No. 12/325,129 | en_US |
dcterms.abstract | A strain sensor (10) for measuring strain greater than 10%, the sensor (10) comprising: an upper polydimethylsiloxane (PDMS) substrate (20) having measurement electrodes (90) extending therethrough; a lower PDMS substrate (30) bonded to a lower surface of the upper PDMS substrate (20), and an upper surface of the lower PDMS substrate (30) having a patterned portion (50); and a conductive fluid (70) contained within the patterned portion (50) in contact with the measurement electrodes (90). | - |
dcterms.bibliographicCitation | US Patent 7,854,173 B2. Washington, DC: US Patent and Trademark Office, 2010. | - |
dcterms.issued | 2010-12-21 | - |
dc.description.country | US | - |
dc.description.oa | Version of Record | en_US |
Appears in Collections: | Patent |
Files in This Item:
File | Description | Size | Format | |
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us7854173b2.pdf | 433.67 kB | Adobe PDF | View/Open |
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